NEWS
When evaluating silicon carbide abrasive versus diamond lapping film, several fundamental differences emerge that affect their performance in precision surface finishing applications.
Diamond lapping films feature the hardest known abrasive material (Mohs 10), making them ideal for processing ultra-hard materials like tungsten carbide, sapphire, and ceramic substrates. Silicon carbide abrasives (Mohs 9-9.5) provide excellent cutting performance for glass, quartz, and most metals at a more economical price point.
For optical polishing pads and lens finishing, diamond lapping films excel in producing nanometer-level surface finishes required for high-performance optical components. Silicon carbide abrasives remain popular for preliminary grinding stages due to their cost-effectiveness in removing larger surface imperfections.
In wafer backgrinding and IC packaging, diamond films provide superior consistency for ultra-thin silicon wafers below 100μm thickness. Our aluminum oxide film alternatives offer intermediate solutions for less demanding applications.
While diamond lapping films command a 3-5x price premium over silicon carbide abrasives, their extended service life often results in lower cost-per-part in high-volume production. Key factors influencing total cost include:
XYT's engineering team recommends the following selection criteria:
With 14+ years of expertise in advanced abrasive materials, XYT offers:
Contact our abrasives specialists today to optimize your surface finishing process with the right balance of performance and cost-efficiency.
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