Production‑Ready MTP® / MPO Ferrule Polishing SOP
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Production‑Ready MTP® / MPO Ferrule Polishing SOP

(Compliant with IEC 61755 / Telcordia GR‑326 standards)

This standard operating procedure is based on real polishing steps documented in industry sources for MTP/MPO ferrules (e.g., 12F, 16F, 24F, 32F and higher density). It reflects common film/slurry sequences, materials, and process considerations used in production lines. Lapping Film+1

ST



1. Purpose

Provide a controlled, repeatable process for polishing MTP/MPO connectors to achieve:

  • Precise fiber height and radius control

  • Low insertion loss (IL) and high return loss (RL)

  • Mirror‑finish endfaces free of scratches or pits

Connector types covered: MTP-12, MTP-16, MTP-24, MTP-32 and higher density (UPC and APC variants). Lapping Film

CMO MPO (1)



2. Equipment & Consumables

Polishing films & slurries

  • Silicon Carbide (SiC) film/slurry

  • Diamond lapping film

  • Aluminum Oxide (Al₂O₃) film/slurry

  • Silicon Dioxide (SiO₂) or Cerium Oxide (CeO₂) sub‑micron finishes
    (All used in multi‑step sequences documented for MTP/MPO ferrule polishing) Lapping Film+1

Polishing pads

  • Glass, ceramic, or precision hard platens

  • Pads chosen to match polishing film/slurry and connector type Lapping Film

Fluid

  • DI water or DI water + polishing slurry

  • IPA (isopropyl alcohol) for cleaning between steps

Inspection

  • Fiber inspection microscope

  • Interferometer for geometry, radius, fiber height

  • IL/RL test set


3. Safety & Cleanliness

✔ Use lint‑free wipes
✔ Rinse and dry after every step
✔ Avoid cross‑contamination between grits
✔ Use fresh films/slurry — do not reuse across steps Lapping Film


4. Standard Polishing Sequence – Multi‑Step Workflow

Step 1 – Epoxy Removal & Pre‑Geometry

Goal: Remove epoxy flash/uneven surface; set baseline geometry

Film/SlurryMicronPadComments
SiC or Diamond15–30 µmGlass / HardRapid removal of epoxy and surface peaks
✔ Polish ~30–60 sec; low speed


Explanation: This step clears epoxy flash and begins shaping the ferrule surface for subsequent geometry control. Lapping Film



Step 2 – Geometry Shaping & Fiber Height Control

Goal: Define radius, fiber height uniformity

FilmMicronPadComments
SiC or Diamond9–3 µmGlassEstablish smooth geometry
Aluminum Oxide3–1 µmGlassRefine geometry
Explanation: Intermediate grit progression smooths transitional scratches and improves uniformity. Lapping Film



Step 3 – Fine Pre‑Polish

Goal: Remove coarse scratches and prepare for final finish

Film/SlurryMicronPadComments
Diamond / SiC / Alumina1 µmGlassPrepares surface for final polish
Explanation: A fine pre‑polish step reduces roughness and minimizes defects before final finishing. Lapping Film



Step 4 – Final Optical Polish

Goal: Achieve mirror finish, low micro‑scratches

MediaMicronPadComments
Silicon Dioxide (SiO₂) or Cerium Oxide (CeO₂) slurry/filmSub‑micron (0.3–0.05 µm)Glass/PadFinal high quality endface finish
Explanation: Final ultra‑fine sub‑micron abrasives produce the smoothest surfaces and best optical performance (low IL, high RL). Lapping Film+1



5. Process Parameters

Pressure: Moderate, consistent, avoid heavy pressure
Lubrication: DI water or appropriate slurry fluid
Motion: Orbital or figure‑8 on flat platen
Inspection between steps: Microscopy + cleaning
Post‑polish test: IL/RL with optical test set


6. Inspection & Criteria

Inspect after each step
✔ No deep scratches or pits
✔ Uniform fiber height (within hundreds of nm)
✔ Controlled radius and apex offset
✔ Final IL/RL meets connector specification

Rework guidance

  • Scratches remain: Repeat previous grit or step up grit as needed

  • Geometry issue: Adjust dwell time or return to earlier grit stage

  • Contamination: Clean thoroughly and resume correct grit progression


7. Notes & Tips (Industry Practice)

🔹 Always use fresh films and slurries for each production run.
🔹 Thorough cleaning between every stage is essential to avoid cross‑contamination.
🔹 Monitor fiber height and geometry with reliable instruments.
🔹 For APC connectors, set and verify angle at the epoxy removal stage. Lapping Film


8. Summary: Recommended Grit Progression

Typical sequence for high‑performance MTP/MPO ferrules (12F–32F):

  1. SiC / Diamond – 15–30 µm → epoxy removal

  2. SiC / Diamond – 9–3 µm → geometry & fiber height

  3. SiC / Diamond / Al₂O₃ – 1 µm → pre‑polish

  4. SiO₂ or CeO₂ – sub‑µm → final optical finish Lapping Film+1


Key Takeaways

✔ MTP/MPO polishing is a multi‑stage, diminishing grit process.
✔ Start with aggressive removal, finish with precision sub‑micron polishing.
✔ Cleaning and fresh consumables are essential for top performance.
✔ Final finish quality directly impacts IL and RL.

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